The differences between power electronic modules and semiconductor modules do not merely lie in the connection technology. Another factor of distinction is the integration degree of additional active and passive components. Depending on the integration degree, they can be classified into the following categories: standard modules, intelligent power modules (IPMs), and (integrated) subsystems. While IPMs are widely used (especially in Asia), the use of integrated subsystems is just beginning. [2] [4]
1. Intelligent Power Modules (IPMs)
The characteristic of intelligent power modules is that in addition to power semiconductor devices, there are also driver circuits. Many IPM modules are also equipped with temperature sensors and current balance circuits or shunt resistors for current measurement. Usually, intelligent power modules also integrate additional protection and monitoring functions, such as overcurrent and short-circuit protection, driver power supply voltage control, and DC bus voltage measurement, etc. [2] [4]
However, most intelligent power modules do not perform electrical isolation on the power side of the signal input. Only a few IPMs contain an integrated optocoupler. Another isolation solution is to use a transformer for isolation. [2] [4]
Typically, the characteristics of small-scale IPMs lie in their lead frame technology. Copper plates with holes are used as carriers for power switches and driver ICs. Heat dissipation is achieved through a thin layer of plastic or insulating metal plate. [2] [4]
Representative IPMs include Semikron’s SKiIP series, which was showcased at the 2026 Wuhan exhibition as a water-cooled solution for 2400A intelligent power modules for electric vehicles. [5] These modules are mounted on air-cooled or water-cooled coolers and undergo comprehensive testing before delivery. [2] [4]
An interesting trend is the upgrading of standard modules to IPMs. Upgrades can be carried out directly or using adapter boards with driver circuits (connected by springs). Semikron’s Skypertm driver is an ideal product in this regard. [2] [4]
2. Integrated Subsystems
The common feature of all these IPMs is true “intelligence”, that is, the controller that converts setpoint values into drive pulse sequences is not included in the module. Semikron is the core manufacturer of integrated subsystems for converters below 250kw. The SKAI module is also an IPM, characterized by an integrated DSP controller, capable of performing other communication tasks in addition to pulse width modulation. These subsystems also include integrated DC link capacitors, an auxiliary power supply, a precise current sensor, and a liquid cooler. [2] [4]
The 2026 Wuhan International Automotive Engineering and Equipment Exhibition will focus on IGBT/SiC power semiconductor technology, and the concurrent New Energy Vehicle Industry Innovation Development Forum will discuss the innovative paths of this technology in electric drive assemblies, thermal management systems, and charging infrastructure.